发明名称 |
Method for bonding a semiconductor substrate to a metal substrate |
摘要 |
A method of bonding a semiconductor substrate to a metal substrate is disclosed. In some embodiments the method includes forming a semiconductor device in a semiconductor substrate, the semiconductor device comprising a first surface. The method further includes obtaining a metal substrate. The metal substrate is bonded to the first surface of the semiconductor device, wherein at least a portion of the metal substrate forms an electrical terminal for the semiconductor device.
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申请公布号 |
US7635635(B2) |
申请公布日期 |
2009.12.22 |
申请号 |
US20060400731 |
申请日期 |
2006.04.06 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
YILMAZ HAMZA;WANG QI;LI MINHUA;WU CHUNG-LIN |
分类号 |
H01L21/46 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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