| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transport cradle for a substrate capable of being repeatedly used in a solder printing and reflow process, and in a flow process, and even if component packaging is performed two times or more to the substrate already packaged with components by the flow process, heat stress to the already packaged components is largely reduced. <P>SOLUTION: The transport cradle includes a carrier on which an escape part for the mounted components on the substrate is disposed, and a frame capable of attaching the carrier , and the carrier can be changed according to the pattern of the substrate, wherein a distance from the mounted components to the wall face of the carrier is 5 mm or longer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
