| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon condenser microphone package which allows acoustic energy to contact a transducer and provides a necessary pressure reference while, at the same time, protecting the transducer from light, electromagnetic interference, and physical damage. SOLUTION: A silicon condenser microphone package 10 includes a transducer 12, a substrate 14, and a cover. The substrate has an upper surface with a recess formed therein. The transducer is attached to the upper surface of the substrate and a back volume 18 of the transducer is formed between the transducer and the substrate, and overlaps with at least a portion of the recess. The cover is placed over the transducer and has an opening. COPYRIGHT: (C)2010,JPO&INPIT |
