| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily control the atmosphere in a treatment space at the periphery of an object to be treated, to reduce size in a horizontal direction, and to reduce the treatment space for treating a wafer. Ž<P>SOLUTION: A liquid treatment apparatus includes: a second casing 20; a first casing 10 capable of abutting on the second one 20; a holding section 1 for holding the object W; a rotation drive section 60 for rotating the object W held by the holding section 1; surface-side treatment liquid supply nozzles 51a, 52a for supplying a treatment liquid to the periphery of the surface of the object W held by the holding section 1; and a storage section 23 that is disposed at the rear side of the object W held by the holding section 1 and stores the treatment liquid that has been used for the object W. Each of the first and second casings 10, 20 can be moved in one direction, and the first casing 10 can abut on and separate from the second one 20. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
