发明名称 METHOD OF MANUFACTURING BENDABLE SOLID STATE LIGHTING
摘要 The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.
申请公布号 US2009311810(A1) 申请公布日期 2009.12.17
申请号 US20090546715 申请日期 2009.08.25
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 YANG CHIEN-CHENG;HSU CHAO-KAI;CHANG JING-YAO
分类号 H01L33/00;H01L21/77 主分类号 H01L33/00
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