| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip size package semiconductor device having excellent stress resistance performance, high quality and high reliability. Ž<P>SOLUTION: The chip size package semiconductor device 100 includes: a packaged semiconductor chip 110 where projecting electrodes 107 electrically connected to an integrated circuit of a semiconductor chip 101 are arranged on the surface side of the semiconductor device; and a silicon substrate of the semiconductor chip 101 is exposed over the whole surface of the backside thereof. A plate-like metallic body 108 for protecting the silicon substrate of the semiconductor chip 101 from external force is stuck to the backside of the packaged semiconductor chip 110. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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