| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape capable of naturally separating a die bonding film having a semiconductor chip from a base material film after dicing a semiconductor wafer. Ž<P>SOLUTION: The dicing-die bonding tape 1 is used for dicing a semiconductor wafer, obtaining a semiconductor chip, and die-bonding the semiconductor chip. The dicing-die bonding tape 1 has the base material film 4, a die bonding film 3 stuck on one surface 4a of the base material film 4, and a dicing film 5 stuck on the other surface 4b at a side opposite to one surface 4a of the base material film 4. The adhesive force of one surface 4a of the base material film 4 is weaker than that of the other surface 4b, and the base material film 4 is not surface-treated. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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