| 摘要 |
The present invention provides a rear illuminated image sensor for illuminating light from the rear of a wafer, and a manufacturing method for same. To this end, the present invention provides a rear illuminated image sensor including: a light receiving element formed in a first substrate; an interlayer insulating layer formed on the first substrate containing the light receiving element; a via hole spaced apart from the light receiving element and formed so as to penetrate through the interlayer insulating layer and the first substrate; a spacer formed on an inner wall of the via hole; an alignment key formed to be received in the via hole; a wire layer formed into multi-layers on the interlayer insulating layer, and which has a lowermost layer with a back surface connected to the alignment key; a protective layer formed to cover the wire layer; a pad formed locally on a back surface of the first substrate and connected to a back surface of the alignment key; and a color filter and a microlens formed on the back surface of the first substrate so as to correspond with the light receiving element. |
