发明名称 SUPER SELF-ALIGNED TRENCH MOSFET DEVICES, METHODS AND SYSTEMS
摘要 <p>A manufacturing process and design structure for a super self-aligned trench power MOSFET. A plurality of super self-aligned trenches of different depths are formed into the body layer and epitaxial layers, preferably by using a multilayer stack of dielectric material etched to form spacers. Respective trenches contain gate conductors, body-contact conductors, and preferably a third trench containing a recessed field plate. This results in a MOSFET structure having high cell density and low gate charges and gate-drain charges.</p>
申请公布号 WO2009151657(A1) 申请公布日期 2009.12.17
申请号 WO2009US35073 申请日期 2009.02.25
申请人 MAXPOWER SEMICONDUCTOR INC.;DARWISH, MOHAMED, N.;ZENG, JUN 发明人 DARWISH, MOHAMED, N.;ZENG, JUN
分类号 H01L21/336 主分类号 H01L21/336
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