| 摘要 |
<p>An apparatus for forming a semiconductor wafer protection film is provided with an apparatus base and a surface plate having apertures which can pass through ultraviolet; a light reflecting body which is attached to a lower section of the surface plate and reflects ultraviolet upward; an ultraviolet radiation means which is attached to a lower section of the light reflecting body and radiates ultraviolet upward; a lift member arranged to move up/down at an upper position of the surface plate; an ultraviolet transmitting pressure receiving member which is attached to an upper surface of the surface plate to cover the apertures and has a flat upper surface whereupon the semiconductor wafer can be placed; a pressurizing member, which is positioned on a lower side of the lift member, attached to the lift member through an angle adjusting means by facing the pressure receiving member, and has a flat lower surface; and an electrical cylinder for bringing up/down the lift member.</p> |
