发明名称 METHOD FOR ALIGNMENT OF WAFER AND ALIGNING EQUIPMENT USING OF IT
摘要 PURPOSE: A method for alignment of a wafer and an aligning apparatus using of it are provided to prevent a failure of processing a wafer in advance by arranging a wafer coated with a resin layer easily. CONSTITUTION: In a device, a wafer mounted on a work table and a notch is detected by a camera(S1). The notch is defined an image having at least one notch points. At least one reference point detected on the image is protruded by using notch point(S3). The center of the reference line is recognized(S4). The reference line is extracted from the center point at the image in which a virtual line having a command angle(S5). The central line of the wafer is extracted by using the virtual line(S6). The wafer is aligned to align an alignment line of the work table and the central line of wafer by using an aligning device(S7).
申请公布号 KR20090129753(A) 申请公布日期 2009.12.17
申请号 KR20080055834 申请日期 2008.06.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, YOUNG SHIN;JEONG, KI KWON
分类号 H01L21/68 主分类号 H01L21/68
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