发明名称 ARM OFFSET ACQUISITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an arm offset acquisition method for a double-sided substrate inspection apparatus, capable of easily and accurately acquiring an arm offset. SOLUTION: The arm offset acquisition method for the double-sided substrate inspection apparatus 1, equipped with a first measurement unit 10 and a second measurement unit 20 includes (a) moving the first measurement unit 10 to a predetermined position of an X-Y coordinate, driving a vertical mechanism of a Z-axis unit 14, and moving down a probe 15 to a probing position; and (b) moving a position compensation camera 26 of the second measurement unit 20, to the same coordinate position as the probe 15 of the first measurement unit 10, photographing a tip of the probe 15 of the first measurement unit 10 to detect a position thereof, by using the position compensation camera 26 of the second measurement unit 20, digitizing an error from a theoretical value, acquiring an arm offset for the first measurement unit 10, and similarly acquiring an arm offset for the second measurement unit 20. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009294155(A) 申请公布日期 2009.12.17
申请号 JP20080149944 申请日期 2008.06.06
申请人 HIOKI EE CORP 发明人 KONDO HISAYUKI;MEGURO YASUSHI;SHIOZAKI KAZUHIKO
分类号 G01B11/00;G01R31/02;H05K3/00 主分类号 G01B11/00
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