发明名称 COOLING SYSTEM FOR ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooling system which most suitably and efficiently cools a heating element which is freely attached to an electronic apparatus. Ž<P>SOLUTION: The cooling system includes: a first cooling member 61 which is thermally connected to a CPU 53 as the heating element placed on a circuit board 54, in a prescribed area and is held so as to be attached to and detached from an electronic apparatus 1 integrally with the circuit board 54 in order to transfer the heat of the CPU 53 to another area; a second cooling member 62 which performs thermal conversion of the heat of the heating element 53 in the outside of the electronic apparatus 1 or in the outside of a space where the electronic apparatus is installed; and a third cooling member 63 thermally connecting the first cooling member 61 and the second cooling member 62 to each other. The third cooling member 63 is thermally connected to the first cooling member 61 by an operation of mounting the circuit board 54 to the electronic apparatus 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009295762(A) 申请公布日期 2009.12.17
申请号 JP20080147559 申请日期 2008.06.05
申请人 HITACHI LTD 发明人 OGIJI KENJI;KONDO YOSHIHIRO;FUJITA KOJI;NOMURA TOMONORI
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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