Method for manufacturing micromechanical or electronic component, involves attaching substrate material and covering material with each other and relatively positioning to each other by molding tool

摘要

The method involves attaching a substrate material (11) and a covering material (12) with each other and relatively positioning to each other by a molding tool (15). A connection is made between the substrate material and the covering material on a wafer layer. The covering material is arranged in recesses (102) in the molding tool. An independent claim is included for a micromechanical or electronic component with a substrate material.