| 摘要 |
PURPOSE: A light emitting element, light emitting device, and fabricating method of the light emitting element are provided to manufacture small substrates on a large size conductive substrate in bonding, so there is no need an additional apparatus. CONSTITUTION: In a device, a light emitting device(11) includes a circuit board and a plurality of emitting devices arranged on the circuit board. The circuit board includes a base substrate(309) and a plurality of first interconnections(310_1~310_n) and a plurality of second interconnections(320_1~320_n+1) formed on the base substrate. The first interconnections are formed on the base substrate. The second wirings are arranged between first interconnections. Each of first interconnections is expanded in a first direction(DR1). The emitting device includes a conductive substrate and a first electrode electrically connected to the conductive substrate. A light-emitting structure is formed inside the first electrode. A second electrode(151) and a third electrode(152) are formed on a first conductive pattern. |
