| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method and cutter for cutting a film without causing a crack on a hard thin film, and deformation or alteration of lower layer of the hard thin film. <P>SOLUTION: The cutter 20 comprises: a driving means for driving a multilayer film 10 containing a substratum B and an organic film 16 on a surface layer which is harder and thinner than the substratum B; a laminating part 30 for pasting a laminate film 32 at an expected cutting position of an organic film 14 of the driven multilayer film 10; a cutting part 40 for cutting the multilayer film 10 having the laminate film 32 pasted along the expected cutting position from the opposite of the laminate film 32 together with the film 32; and a peeling part 50 for peeling the laminate film 32 after cutting from the multilayer film 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
