| 摘要 |
PROBLEM TO BE SOLVED: To provide a curvature deciding method of a semiconductor wafer that decides whether or not a measured surface of a wafer complicatedly curved is curved to one surface side and the other surface side of the wafer on the whole accurately in a short time. SOLUTION: An area At of a region enclosed with a reference line S as a border and a measurement line R above the reference line is calculated. Similarly, an area Ab of a region enclosed with the reference line and measurement line below the reference line as the border is calculated. The area ratio AR of the region above the reference line as the border and the area of the region below the reference line is calculated from the areas At and Ab thus calculated. COPYRIGHT: (C)2010,JPO&INPIT |
