| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method which can satisfactorily process a substrate surface while suppressing the usage of a rinsing solution. SOLUTION: The rinsing solution is supplied to a substrate surface Wf at a first flow rate (2 (L/min)) to perform an initial rinsing process, and then the rinsing solution is supplied to the substrate surface Wf at a second flow rate (1.5 (L/min)) lower than the first flow rate to perform an intermediate rinsing process, so that the usage of the rinsing solution can be suppressed. Further, a liquid film of the rinsing solution is formed over the substrate surface Wf by using the rinsing solution at a high flow rate before the flow rate of the rinsing solution is reduced, so that the rinsing solution can spread over the substrate surface Wf for covering the entire substrate surface Wf even in the intermediate rinsing process in which the flow rate of the rinsing solution is reduced. Thus it is possible to prevent partial exposure of the substrate surface Wf and satisfactorily perform rinsing on the substrate surface Wf. COPYRIGHT: (C)2010,JPO&INPIT
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