发明名称 |
SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS |
摘要 |
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
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申请公布号 |
US2009309237(A1) |
申请公布日期 |
2009.12.17 |
申请号 |
US20090547439 |
申请日期 |
2009.08.25 |
申请人 |
CHOW SENG GUAN;YING MING;SHIM IL KWON;TAN LIP SENG |
发明人 |
CHOW SENG GUAN;YING MING;SHIM IL KWON;TAN LIP SENG |
分类号 |
H01L23/49;H01L21/56;H01L21/60;H01L23/28 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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