发明名称 POLISHING METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing method and apparatus with simple structure, surely polishing a test piece surface precisely and in parallel with respect to a bottom face of a test piece fixing pedestal. <P>SOLUTION: A supporting tool 2 is fixed by clamping members 4 such as bolts to a surface of a center portion of a rotatably disposed shaft of a rotary polisher 1, so as to concentrically dispose a circular through-hole 3 made in a center portion of the support tool 2 with the surface of the center portion of the rotatably disposed shaft of the rotary polisher 1. The test piece fixing pedestal 6 which is cylindrical and has the test piece fixed on the upper surface (one end surface) thereof can be inserted into the circular through-hole 3 of the supporting tool 2. Furthermore, the polisher 1 is rotated and the upper face (surface) of the test piece is polished, while a pressing and rotating restraining means 7 holds the test piece fixing pedestal 6 inserted into the circular through-hole 3 of the supporting tool 2 so as to press the test piece with predetermined pressing force against the surface of the center portion of the polisher 1, and also restrains the test piece fixing pedestal 6 from rotating. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009291905(A) 申请公布日期 2009.12.17
申请号 JP20080149457 申请日期 2008.06.06
申请人 IHI CORP 发明人 MIYAZAKI SHINYA
分类号 B24B37/04;B24B37/10;B24B37/30 主分类号 B24B37/04
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