| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component to be incorporated into a wiring board, wherein the surface of a copper plating layer formed on the surface of an external electrode can be suitably roughened and adhesiveness with a resin insulating layer on the wiring board can be sufficiently secured. <P>SOLUTION: The ceramic sintered body 104 of a ceramic capacitor has a capacitor main surface 102 and a capacitor rear surface 102. On the capacitor main surface 102 and the capacitor rear surface of the ceramic sintered body 104, a plurality of plane electrodes 111, 112 each of which is formed by forming a copper layer 152 on the surface of a metallized metal layer 151 are arranged. The maximum grain size of copper particles constituting the copper plating layer 152 is≤1μm and two or more copper particles are brought into contact with one of nickel particles constituting the metallized metal layer 151. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
