| 摘要 |
PROBLEM TO BE SOLVED: To suppress an out gas component amount of moisture or the like produced from an adhesive used for fixing a component in a hollow package which is airtightly sealed. SOLUTION: In a device housing apparatus configured by housing a device in the hollow package and airtightly sealing the hollow package, the adhesive for fixing the device in the hollow package is applied in a discrete pattern. COPYRIGHT: (C)2010,JPO&INPIT
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