发明名称 |
DEVICE PACKAGE STRUCTURE, DEVICE PACKAGING METHOD, DROPLET EJECTION HEAD, CONNECTOR, AND SEMICONDUCTOR DEVICE |
摘要 |
A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.
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申请公布号 |
US2009309242(A1) |
申请公布日期 |
2009.12.17 |
申请号 |
US20090543571 |
申请日期 |
2009.08.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
MIZUNO SHINJI;NISHIYAMA YOSHIHIDE;SATO EIICHI |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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