| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal head by which problems of warping of the substrate and handling of substrates in manufacturing can be simply solved, further the degree of freedom of basic design is large, and electric power saving can be effected. Ž<P>SOLUTION: The thermal head is constituted of a three-layer structure consisting of a thermal insulating function layer 2 in which a heating element is formed, a heat radiation function layer 3 arranged in the lower layer of the thermal insulation function layer 2, and a heat storing function layer 4 arranged in the lower layer of the heat radiation function layer 3, and especially the thermal insulation function layer 2 and the heat storing function layer 4 are glass layers 5 consisting of the same material formed by firing at a high temperature. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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