| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface inspecting method which shows little irregularity at each worker and is capable of certainly setting an illumination position. Ž<P>SOLUTION: The surface inspecting method is constituted so as to inspect the vicinity of the edge part of a wafer, by using a surface inspection device equipped with an imaging part for imaging the regular reflected image of the wafer illuminated by vertical illumination and has a setting process (S101) for setting the illumination position in the vicinity of the edge part of the wafer by LED illumination; an illumination process (S102) for irradiating the illumination position set in the setting process (S101) with illumination light by the LED illumination; and an inspection process (S103) for detecting the abnormality in the vicinity of the edge part of the wafer, by detecting the scattered light produced at the illumination position by a photodiode. In the setting process (S101), the regular reflected image in the vicinity of the edge part of the wafer is imaged by the imaging part, and the illumination position by the LED illumination is set by utilizing the regular reflected image in the vicinity of the imaged edge part of the wafer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
