| 摘要 |
PROBLEM TO BE SOLVED: To reduce an influence of a rounding error to be generated in imprint. SOLUTION: The method for manufacturing a semiconductor device includes: a design data preparation step of preparing design data for forming a plurality of patterns on a semiconductor substrate; a first pattern formation step of forming a first resist pattern on the semiconductor substrate to form a first pattern on the semiconductor substrate using the first resist pattern; and a second pattern formation step of forming a second resist pattern on the semiconductor substrate using an imprint device after the first pattern formation step to form a second pattern on the semiconductor substrate using the second pattern. In the first pattern formation step, the first pattern which is smaller than a design pattern corresponding to the design data is formed. COPYRIGHT: (C)2010,JPO&INPIT
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