| 摘要 |
PURPOSE:To obtain a high heat-dissipation effect while a low-cost material is used for a stem by a method wherein the heat generated from a specific light-emitting diode pellet is transmitted in the order of a submount and a lead wire brought into contact to that, both having a good heat conductivity, and is guided outside. CONSTITUTION:A submount 2 is provided on a stem 3 integrally formed with a plurality of lead wires and a light-emitting diode pellet 1 consisting of one of materials of GaAs, GaP, GaSb and InP is mounted on the submount 2 having a thermal expansion coefficient approximate to those of the above materials. In such a header for semiconductor element, the end surface of one side of one lead wire 4a of a plurality of the lead wires is directly brought into contact to the other surface of the submount 2, which opposes to the mounting surface of the pellet 1 or through a material having a good thermal conductivity. According to such a structure, even though a low-cost material which can not be said to be good in heat conductivity is used for the stem 3, if a material having a high thermal conductivity is used for the submount 2 and the lead wire 4a brought into contact to that, the heat generated in the pellet 1 can be let escape outside through them. Thereby, reliably holding a good heat-dissipation property and the cutdown of cost of the header can be simultaneously realized. |
