| 摘要 |
<p>Provided is a contact pin with a solder cup. The solder cup is formed directly from the contact pin by a manufacturing process. The manufacturing process includes the steps of providing a wire, securing the wire in a carrier structure, cutting the wire to a predetermined length to form a contact, coining a first end of the contact to a predetermined thickness and forming the first end of the contact into a solder cup.</p> |
