发明名称 CONNECTION METHOD AND SUBSTRATE
摘要 <p>PURPOSE: A connection method and a substrate are provided to maintain the quality of a signal by reducing reflection due to an impedance mismatch. CONSTITUTION: In a device, an end line drawn from and one side of a surface mounted device(2) parallel with a substrate(1) is connected to a line(1A) arranged on the substrate. An end of a dielectric(2A) of the surface mounted device is formed to be inclined. The substrate and the surface mounted device are connected with each other by approaching a metal transmission line arranged on the dielectric according to the incline to the substrate. A cross section of a vertical direction of the surface mounted device has a trapezoid shape. A width of a microstrip line of the surface mounted device is adjusted by an electrical characteristic and geometry of the microstrip line.</p>
申请公布号 KR20090129957(A) 申请公布日期 2009.12.17
申请号 KR20090052226 申请日期 2009.06.12
申请人 SONY CORPORATION 发明人 KIKUCHI MASATO;MOCHIZUKI SHUNSUKE;YOSHIOKA MASAHIRO;ARAKI RYOSUKE;HANDA MASAKI;NAKANISHI TAKASHI;ICHIKI HIROSHI;KONDO TETSUJIRO
分类号 H01L21/60;H05K3/30 主分类号 H01L21/60
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