| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be microfabricated because of its photosensitivity, developed with a dilute aqueous alkali solution and cured at a low temperature (≤200°C), has high flexibility, is excellent in electrical insulation reliability, resistance to the heat of soldering, organic solvent resistance and adhesion to a sealant, ensures small warpage of a substrate after curing, and exhibits excellent defoaming property and leveling property when applied by various application methods. <P>SOLUTION: The photosensitive resin composition includes (A) a terminally carboxylated urethane imide oligomer, (B) a diamino compound and/or an isocyanate compound, (C) a photosensitive resin, (D) a photopolymerization initiator, (E) an organic solvent, and (F) a non-silicone defoaming agent and/or leveling agent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
