| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for successfully and effectively peeling a wafer piece from an adhesive sheet and transferring the wafer piece. SOLUTION: In the method for peeling a chip component 7a (a wafer piece) disposed on a wafer sheet 8a (an adhesive sheet) in a divided state to plural pieces and for transferring it to a target point, a portion in which the chip component 7a as the object of transfer is held on the wafer sheet 8a constricts or expanses by irradiating the portion with a laser beam being output-controlled, and the chip component 7a is sucked by a transferring head 4 to peel it from the wafer sheet 8a and transfer it to the target point. COPYRIGHT: (C)2010,JPO&INPIT |
