发明名称 REDUCED PRESSURE DRYING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent a pin, which supports a substrate to be treated, from being imprinted to the substrate. SOLUTION: The substrate processing apparatus includes: a chamber 106 which accommodates a substrate G to be treated; a pressure reducing means 142 which reduces the pressure within the chamber 106; a plurality of lift pins 128 which are arranged within the chamber 106 and support the substrate G from a lower position; a lift pin moving up/down means 126 which treats some of the plurality of lift pins 128 as a group and moves up and down the lift pins 128 within each group independently, respectively; a substrate temperature range detecting means 133 which detects the temperature of the substrate G, which changes with reduced pressure drying treatment while delimiting the temperature in a predetermined range; lift pin temperature adjusting means 131 and 132 which, in each of lift pins 128 within the group, sets a contact part with the substrate G in the pin to a predetermined temperature included in the temperature range detected by the substrate temperature range detection means 133; and a control means 133 which performs drive control of the lift pin moving up/down means 126. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009295817(A) 申请公布日期 2009.12.17
申请号 JP20080148369 申请日期 2008.06.05
申请人 TOKYO ELECTRON LTD 发明人 YAHIRO SHUNICHI;NIMATA TAKESUKE
分类号 H01L21/027;G03F7/38 主分类号 H01L21/027
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