发明名称 BONDING METHOD AND BONDED MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding method for forming a bonded material obtained by bonding two members having different durability levels interposing a bonding film between the members, and enabling the reuse of the member having higher durability by separating these two members without discarding the whole bonded material at the end of the life of the member having lower durability, and to provide a bonded material formed by using the bonding method. Ž<P>SOLUTION: The bonding method comprises the application of a peeling energy to a bonding film 3 of a bonded material 11 obtained by bonding the first base material 21 and the second base material 22 through a bonding film 3 containing a silicone material to generate cleavage in the bonding film 3, peeling the first base material 21 having residual bonding film 3 from the second base material 22, and bonding the first base material 21 with the third base material 23 different from the second base material 22 through the bonding film 3 to obtain a second bonded material 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009292917(A) 申请公布日期 2009.12.17
申请号 JP20080147242 申请日期 2008.06.04
申请人 SEIKO EPSON CORP 发明人 ITO YOSHIFUMI
分类号 C09J5/00;B41J2/16;C08J7/04;C09J5/02;C09J5/04;C09J5/06;C09J183/04;C09J183/06;C09K3/10 主分类号 C09J5/00
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