| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate dividing device which prevents damage to electronic components mounted on divided product substrates when taking out the divided product substrates. Ž<P>SOLUTION: A substrate dividing device 1 includes: a cutting part (not shown) which divides a substrate 21 into product substrates 21a as products; a substrate loading part 5 on which the substrate 21 is loaded and in which positioning pins 9 inserted into product portions which become product substrates 21a after division of the substrate 21, to position the substrate 21 are formed; and a bellows 11 which includes buffer part 11a to be abutted on lower surface of the product substrate 21a and, after dividing the substrate 21 into the product substrates 21a, causes the buffer part 11a to abut on the lower surface of the product substrate 21a to push up the product substrate 21a up to such a position that the positioning pins 9 come off the product substrate 21a. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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