发明名称 HIGH-PERFORMANCE ELECTRIC STORAGE ELEMENT PACKAGE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide high-performance electric storage element package structure excelling in durability and reliability. SOLUTION: This high-performance electric storage element package structure is provided with: an electric storage element 210 having an upper surface and a bottom surface; a first metal substrate 230 arranged parallel to the upper surface of the electric storage element 210, and using one side extended to the outside of the electric storage element 210 as a first conductive electrode 285; a second metal substrate 250 arranged parallel to the bottom surface of the electric storage element 210, and using one side extended to the outside of the electric storage element 210 in the direction opposite to the extension direction of the first metal substrate 230 as a second conductive electrode 295; and an insulating covering layer 270 covering the outsides of the electric storage element 210, the first metal substrate 230 and the second metal substrate 250, and exposing the first conductive electrode 285 and the second conductive electrode 295. The electric storage element 210 is sandwiched between the first metal substrate 230 and the second metal substrate 250. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009295955(A) 申请公布日期 2009.12.17
申请号 JP20080254564 申请日期 2008.09.30
申请人 CHAN CHIEN CHIANG 发明人 CHAN CHIEN CHIANG
分类号 H01G4/224;H01G4/228;H01G9/155 主分类号 H01G4/224
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