发明名称 LOW-TEMPERATURE CURABLE RESIN COMPOSITION, COATING FILM FORMING METHOD USING THE SAME, RESIN MORTAR AND FIBER-REINFORCED RESIN
摘要 PROBLEM TO BE SOLVED: To provide a low-temperature curable resin composition that is cured in a short time even in a low-temperature environment at≤0°C, has a low odor and excellent workability, impact resistance and durability. SOLUTION: The low-temperature curable resin composition comprises (A) a radically polymerizable resin, (B) a radically polymerizable unsaturated monomer, (C) a cobalt metal salt, (D-1) a hydroxy group-containing aromatic tertiary amine represented by general formula (I) (wherein R<SB>1</SB>is H, CH<SB>3</SB>or OCH<SB>3</SB>; R<SB>2</SB>is a hydroxyalkyl group; and R<SB>3</SB>is an alkyl group or a hydroxyalkyl group) and (D-2) an aromatic tertiary amine represented by general formula (II) (wherein R<SB>4</SB>is H, CH<SB>3</SB>or OCH<SB>3</SB>; and R<SB>5</SB>an R<SB>6</SB>are each independently an alkyl group) and (E) an organic peroxide. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009292890(A) 申请公布日期 2009.12.17
申请号 JP20080145797 申请日期 2008.06.03
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 KUROKI KAZUHIRO;KANAYAMA JUN;YAMAUCHI SHINTARO;KINOSHITA MICHIAKI
分类号 C08F290/00;C08F4/40 主分类号 C08F290/00
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