PHOTOSENSITIVE RESIN COMPOSITION FOR HOLLOW PACKAGE, CURED PRODUCT THEREOF, MULTILAYER BODY USING THE RESIN COMPOSITION AND MICRODEVICE

摘要

Disclosed is a photosensitive resin composition for hollow packages, which exhibits high strength even at high temperatures and enables retention of a sufficient hollow structure even when a device having a hollow structure is sealed by transfer molding.  The photosensitive resin composition for hollow packages contains (A) a trisphenolmethane epoxy resin represented by formula (1) and (B) a cationic photopolymerization initiator.  A multilayer body is obtained using the photosensitive resin composition for hollow packages, and a device having a hollow structure, especially a device for MEMS having a hollow structure is produced by using the photosensitive resin composition for hollow packages or a multilayer body obtained using the composition.  (In formula (1), R's independently represent a hydrogen atom, an alkyl group having 1-6 carbon atoms, an allyl group or a phenyl group; m's represent the numbers of R's, which are respectively an integer of 1-3; and n represents an average satisfying 0 = n = 10.)