发明名称 ELEMENT TRANSFER DEVICE, ELEMENT TRANSFER METHOD, AND METHOD OF MANUFACTURING DISPLAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure which allows a transfer substrate and a temporary holding substrate to be quickly brought closer to each other with a desired gap without contacting when aligning transfer positions of elements in an element transfer step. <P>SOLUTION: An element transfer device includes: a first substrate-supporting part 11 supporting a transfer substrate 16; a second substrate-supporting part 12 supporting a temporary holding substrate 17 holding a plurality of elements 18 to be transferred to the transfer substrate; an elevation driving part 13 moving the temporary holding substrate 17 toward and away from the transfer substrate 16; and aligning means (14 and 15) aligning transfer positions of elements 18 in a state where both of substrates are brought closer to each other with a prescribed gap. The second substrate supporting part 12 includes: a substrate suction part 22 having a porous material 26 for sucking the temporary holding substrate 17; and a pressure means which applies a pressure to the substrate suction part 22 in such a direction that the temporary holding substrate 17 sucked to the substrate suction part is bent so as to be convex toward the transfer substrate 16. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009295853(A) 申请公布日期 2009.12.17
申请号 JP20080149169 申请日期 2008.06.06
申请人 SONY CORP 发明人 MIURA YOSHIHISA
分类号 G09F9/00;H01L33/32;H01L33/48 主分类号 G09F9/00
代理机构 代理人
主权项
地址