发明名称 |
ELEMENT TRANSFER DEVICE, ELEMENT TRANSFER METHOD, AND METHOD OF MANUFACTURING DISPLAY DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure which allows a transfer substrate and a temporary holding substrate to be quickly brought closer to each other with a desired gap without contacting when aligning transfer positions of elements in an element transfer step. <P>SOLUTION: An element transfer device includes: a first substrate-supporting part 11 supporting a transfer substrate 16; a second substrate-supporting part 12 supporting a temporary holding substrate 17 holding a plurality of elements 18 to be transferred to the transfer substrate; an elevation driving part 13 moving the temporary holding substrate 17 toward and away from the transfer substrate 16; and aligning means (14 and 15) aligning transfer positions of elements 18 in a state where both of substrates are brought closer to each other with a prescribed gap. The second substrate supporting part 12 includes: a substrate suction part 22 having a porous material 26 for sucking the temporary holding substrate 17; and a pressure means which applies a pressure to the substrate suction part 22 in such a direction that the temporary holding substrate 17 sucked to the substrate suction part is bent so as to be convex toward the transfer substrate 16. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009295853(A) |
申请公布日期 |
2009.12.17 |
申请号 |
JP20080149169 |
申请日期 |
2008.06.06 |
申请人 |
SONY CORP |
发明人 |
MIURA YOSHIHISA |
分类号 |
G09F9/00;H01L33/32;H01L33/48 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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