| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To quickly and surely decide an unpatterned part in the thin film of a substrate to be machined. <P>SOLUTION: A laser beam machining apparatus machines a target substrate 60 to be used for a solar cell having a substrate 61 and a thin film 62 arranged on the substrate 61. The laser beam machining apparatus includes a holder part 65 for holding the target substrate 60, a laser oscillator 1 that machines the thin film 62 by irradiating the thin film 62 of the target substrate 60 with a laser beam L, and a transfer mechanism 5 that relatively moves the irradiation position of the laser beam L for the thin film 62 of the target substrate 60 held by the holder part 65. The light L', P' passed through the target substrate 60 or the light L'', P'' reflected by the target substrate 60 are detected by an optical sensor 10 and, on the basis of a signal from the optical sensor 10, a discriminating section 51 discriminates whether or not patterning is normally performed by the laser beam L for the thin film 62 of the target substrate 60. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
