METHOD OF MANUFACTURING HEAT DISSIPATION STRUCTURE, AND HEAT DISSIPATION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipating material which has high thermal conductivity and comes into contact with fine unevenness on a surface of a heat generating source by entering gaps thereof without any clearance, and a method of manufacturing the same. SOLUTION: The method of manufacturing the heat dissipation structure is characterized in supplying a current to an SiC substrate or a substrate having an SiC layer on at least one surface, heating SiC with Joule heat generated when the current is supplied, and forming an SiC whisker layer on the SiC surface of the substrate. Further, the specific resistance of the substrate is≤1×10-1Ωcm. COPYRIGHT: (C)2010,JPO&INPIT