| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus which is suitable for reduction in size and which suppresses temperature elevation of a solid-state imaging device by radiating heat generated from the imaging device and heat generated from electronic components. SOLUTION: An imaging apparatus 20 includes an objective optical unit 30 and an imaging unit 40. The imaging unit 40 includes: a device frame 42 fixed on a lens frame 33; an imaging device 41 fixed on the device frame 42 and including a light-receiving plane, whereon an optical image passed through the objective optical unit 30 is formed; a circuit board 43, electrically connected to the imaging device 41, whereon electronic components 52, 53, 54, ..., are packaged; a signal cable 44 including signal lines 44a, 44b, 44c, ..., connected to the circuit board 43; and an imaging apparatus exterior frame 46 overlaying these imaging device 41, circuit board 43 and signal cable 44 partially. The imaging unit 40 then includes a heat radiating member 45, to which heat generated from the imaging device 41 or heat generated from the electronic components 52, 53, 54, ..., packaged on the circuit board 43 is transferred, having a heat radiating through-hole 45a which radiates the transferred heat to the outside. COPYRIGHT: (C)2010,JPO&INPIT
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