| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for measuring a board thickness, capable of sensitively measuring a thickness value of a board, even in the case any oxide film is formed on a material to be measured. Ž<P>SOLUTION: The method includes: an ultrasonic generating means 11 which irradiates the surface of the material to be measured 2 with a laser beam, thereby generating an ultrasonic wave and removing the oxide film; an ultrasonic detecting means 12 which is disposed on the downstream side in the conveying direction of the material to be measured 2; a material conveying means 14 for conveying the material to be measured 2; a control means 15 which carries out a control, thereby bringing the ultrasonic generating means 11 to irradiate a prescribed position of the material to be measured 2 with the laser beam and remove the oxide film, and after a movement of the prescribed position for a predetermined distance on the downstream side in the conveying direction of the material to be measured 2, which irradiates another prescribed position being positioned on the upstream side in the conveying direction on the basis of above prescribed position, with the laser beam to remove the oxide film, and further generates the ultrasonic wave and brings the ultrasonic detection means 12 to carry out a detection through the prescribed position; and an operation processing means 13 which calculates the board thickness of the material to be measured 2, based on a detection result of the ultrasonic detection means 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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