发明名称 |
Method for Making Micro-Electromechanical System Devices |
摘要 |
A method for making micro-electromechanical system devices includes: (a) forming a sacrificial layer on a device wafer; (b) forming a plurality of loop-shaped through-holes in the sacrificial layer so as to form the sacrificial layer into a plurality of enclosed portions; (c) forming a plurality of cover caps on the sacrificial layer such that the cover caps respectively enclose the enclosed portions of the sacrificial layer; (d) forming a device through-hole in each of active units of the device wafer so as to form an active part suspended in each of the active units; and (e) removing the enclosed portions of the sacrificial layer through the device through-holes in the active units of the device wafer.
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申请公布号 |
US2009311819(A1) |
申请公布日期 |
2009.12.17 |
申请号 |
US20080244258 |
申请日期 |
2008.10.02 |
申请人 |
CHANG TSO-CHI;WU MINGCHING |
发明人 |
CHANG TSO-CHI;WU MINGCHING |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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