发明名称 METHOD FOR CUTTING GLASS SUBSTRATE, METHOD FOR CUTTING SUBSTRATE FOR DISPLAY PANEL AND METHOD FOR MANUFACTURING SUBSTRATE FOR DISPLAY PANEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for cutting a glass substrate by which the life of a cutting wheel can be prolonged. Ž<P>SOLUTION: The method for cutting the glass substrate for a display panel, on the surface of which a wiring pattern is formed, includes: a step of linearly removing the wiring pattern 1031 by irradiating the wiring pattern 1031 (pattern of metal thin film) formed on the surface of the substrate 1 (glass substrate) for a display panel with a laser beam; and a step of forming a scribe line along the position where the wiring pattern 1031 is removed by the irradiation with the laser beam L by a cutting wheel 8 to cut the substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009292699(A) 申请公布日期 2009.12.17
申请号 JP20080150275 申请日期 2008.06.09
申请人 SHARP CORP 发明人 OKUYAMA MOTOHIRO
分类号 C03B33/02;G02F1/13;G02F1/1333;G09F9/00 主分类号 C03B33/02
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