| 摘要 |
<p>Provided is a semiconductor integrated circuit equipped with an I/O cell (161), a first PAD (162) and a second PAD (142) that are connected to the I/O cell (161), a first package wire (166) that is connected to the first PAD (162) and can be connected outside said semiconductor integrated circuit, and a second package wire (146) that is connected to the second PAD (142) and can be connected outside said semiconductor integrated circuit. The connection point (163) of the first PAD (162) and the first package wire (166) is inside the area where the I/O cell (161) is provided, and the connection point (143) of the second PAD (142) and the second package wire (146) is in an area outside the I/O cell (161).</p> |
