| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a wafer exposure method and an EUV exposure apparatus which are capable of easily improving the throughput of wafer exposure. <P>SOLUTION: The wafer exposure method includes: an EUV exposure step of subjecting a product region which becomes a product chip, on a wafer 5 to EUV exposure by an EUV exposure processing part 1; and an EB exposure step of subjecting a peripheral region on the wafer 5 to EB exposure by an EB exposure part 20C. While one wafer 5 is subjected to EUV exposure by the EUV exposure processing part 1, another wafer 5 different from the wafer 5 subjected to EUV exposure is subjected to EB exposure by the EB exposure part 20C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
