发明名称 Thermal conduction principle and device of the multi-layers structure with different thermal characteristics
摘要 The present invention innovatively discloses a relay thermal conductor being made of material with better thermal conducting characteristics, wherein one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having higher specific heat capacity is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body.
申请公布号 US2009308584(A1) 申请公布日期 2009.12.17
申请号 US20080155966 申请日期 2008.06.12
申请人 YANG TAI-HER 发明人 YANG TAI-HER
分类号 F28F7/00 主分类号 F28F7/00
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