发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
<p>The semiconductor device is equipped with a semiconductor substrate (11), a first transistor (20) that is formed in a first region (13) of the semiconductor substrate (11), and a second transistor (30) that is formed in a second region (14). The first transistor (20) has a first gate insulating film (21) and a first gate electrode (22), and the second transistor (30) has a second gate insulating film (31) and a second gate electrode (32). The first gate insulating film (21) and the second gate insulating film (22) [sic; (31)] comprise a first insulating film (41) and a second insulating film (42). At least a part of the elements contained in the first gate electrode (22) and the elements contained in the second gate electrode (32) are different.</p> |
申请公布号 |
WO2009150770(A1) |
申请公布日期 |
2009.12.17 |
申请号 |
WO2009JP00803 |
申请日期 |
2009.02.24 |
申请人 |
PANASONIC CORPORATION;MITSUHASHI, RIICHIROU;OIKAWA, KOTA |
发明人 |
MITSUHASHI, RIICHIROU;OIKAWA, KOTA |
分类号 |
H01L27/092;H01L21/8238;H01L29/423;H01L29/49;H01L29/78;H01L29/786 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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