发明名称 METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS
摘要 PURPOSE: A method and an apparatus for mounting conductive balls are provided to improve productivity by increasing the transfer speed of an adsorbent or a ball cup. CONSTITUTION: In a device, a ball cup(5) has an internal space. An opening(51) is formed at a lower part of the ball cup. The internal space of the ball cup is divided into a upper part for an adsorbent(52) and lower part(54). The upper part of the ball cup is formed with a casing(66) of the adsorbent. The adsorbent is installed at the lower-part of the casing. A storage of a suction unit includes the ball cup, the adsorbent, the casing. The adsorbent is manufactured by a wire netting like the stainless mesh to pass through gas. The upper part is connected to a vacuum source(59) through a suction path by an electron alteration valve(57) and a regulator(58).
申请公布号 KR20090129721(A) 申请公布日期 2009.12.17
申请号 KR20080055785 申请日期 2008.06.13
申请人 SHIBUYA KOGYO CO., LTD. 发明人 IKEDA KAZUNARI
分类号 H01L21/60 主分类号 H01L21/60
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