| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device using a strap member, which can improve productivity and production efficiency while more reducing resistance of internal resistance, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: The semiconductor device is equipped with: a semiconductor element 2; a lead 3 having an electrode to be connected to an electrode provided in the semiconductor element 2; metal wire W which electrically connects the electrode of the semiconductor element 2 with the electrode of the lead 3, and an area except an area joined to the semiconductor element 2 and an area joined to the lead 3 of the metal wire W is formed thinner than the area joined to the semiconductor element 2 and the area joined to the lead 3. <P>COPYRIGHT: (C)2010,JPO&INPIT |
